Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

Hamzah, Khairum and Waini, Iskandar and Mohd Nordin, Muhammad Haziq Iqmal and Nik Long, Nik Mohd Asri and Khashi’ie, Najiyah Safwa and Zainal, Nurul Amira and Sayed Nordin, Sayed Kushairi (2023) Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings. Journal of Advanced Research in Applied Mechanics, 113 (1). pp. 27-36. ISSN 2289-7895

[img] Text
0215325012024132323694.PDF
Download (612kB)

Abstract

In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients.

Item Type: Article
Uncontrolled Keywords: Bonded materials, Curvilinear crack, Hypersingular integral equations, Stress intensity factors, Thermoelectric
Divisions: Faculty Of Industrial And Manufacturing Technology And Engineering
Depositing User: Sabariah Ismail
Date Deposited: 01 Jul 2024 09:50
Last Modified: 01 Jul 2024 09:50
URI: http://eprints.utem.edu.my/id/eprint/27244
Statistic Details: View Download Statistic

Actions (login required)

View Item View Item