Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire

Ng, Shay Lee (2016) Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire. Masters thesis, Universiti Teknikal Malaysia Melaka.

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Abstract

Silver spot plated copper leadframe play very importance role in semiconductor industry.Throughout the semiconductor industry intense economic competition has stimulated interest in the area of package cost reduction per year function over the range of products it offers.In an attempt to meet the demand packages cost down,semiconductor has to find an alternative solution from packaging where manufacturing efficiencies such as cycle time reduction,supply chain management and yield improvement allow for continued reductions in the cost to achieve lowest manufacturing cost.In order to development of a new thickness silver spot plated copper leadframe involves a wide variety of issues which must be addressed.Example characterization was made in the areas of leadframe material with the molded package.However,the characteristic of thickness silver plated on copper leadframe towards bondability and reliability is not studied in depth.In this research,evaluation will be performed to study the bondability and reliability on various thickness of silver plated copper leadframe with 25um wire diameter of copper and gold wire.Relative average plating thickness of the leadframe surface will be measured prior to the evaluation.Leadframe with 3 different silver plated thicknesses and 25um wire diameter on gold wire and copper wire will be used for each evaluation.Therefore,in bondability process,wedge pull test on lead will be collected during this study to check the correlation between 2nd bond quality and silver plated thickness.The shear test will be performed in order to find out the relationship between the mechanical strength of the ball and the characteristics of the electroless silver layer deposited.The wedge integrity after stress will be investigated through extreme temperature of Temperature Cycle (TC) test.

Item Type: Thesis (Masters)
Uncontrolled Keywords: Metal bonding,Copper wire
Subjects: T Technology > T Technology (General)
T Technology > TS Manufactures
Divisions: Library > Tesis > FKP
Depositing User: Mohd. Nazir Taib
Date Deposited: 03 Apr 2018 04:22
Last Modified: 03 Apr 2018 04:22
URI: http://eprints.utem.edu.my/id/eprint/20566
Statistic Details: View Download Statistic

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