Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang.
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XRD ANALYSIS OF CU-AI INTERCONNECT INTERMETALLIC COMPOUND IN AN ANNEALED MICRO-CHIP-KOK YAU CHUA-MAK 00353 RAF.pdf Download (4MB) |
Abstract
Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction (XRD) technique to identify the IMC in the Cu wired micro-chip samples in powder form. Existence of mixture of CuA1 and CuA12 was first confirmed by transmission electron microscope (TEM) and energy dispersive X-ray (EDX). In XRD analysis, peak correspond to CuA1 phase is identified from measurement with slower scan configurarion. The difficulty for IMC peak detection in diffractogram is due to low composition ratio of IMC relative to other materials available in the sample. KOH treatment for enhancing IMC peaks intensity does not work as expected as it etches the IMC as well.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Intermetallic compounds, Analysis, Data processing |
| Subjects: | T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Faculty of Manufacturing Engineering |
| Depositing User: | Users 4097 not found. |
| Date Deposited: | 15 Dec 2017 00:35 |
| Last Modified: | 25 May 2023 11:10 |
| URI: | http://eprints.utem.edu.my/id/eprint/20186 |
| Statistic Details: | View Download Statistic |
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