Che Othaman, Siti Syahirah (2021) Mechanical characterisation of hybrid GNPS and functionalised BN as a thermal interface material. Masters thesis, Universiti Teknikal Malaysia Melaka.
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Abstract
Electronic industries are continually striving to miniaturise electronic devices that have high power density in many current technologies. This development has caused significant challenges in the removal of heat generated from the small devices, which gradually caused overheat, especially for the electronic components that have a high working temperature like aircraft, Electric Vehicle (EVs), oil and gas and many more. The heat produce will cause damage which affected its life span. Thermal Interface Material (TIM) with high thermal conductivity is one of the methods to reduce the heat generated. From the past decade, the rapid development of new TIM by using high intrinsic thermal conductivity fillers like Boron Nitride (BN) and Graphene nanoplatelets (GNPs) in polymer composite has surged as a novel Thermally Conductive Adhesive (TCA). The focus on improving the thermal conductivity of TIM of polymer composite has heightened the need to hybridise both BN and GNPs filler at different filler sizes. Besides, modification of filler, especially BN filler, can also improve the properties of composites. However, to the best of author knowledge, very few studies have reported on the mechanical properties of the hybrid GNPs/f-BN polymer composite, especially at high temperature, to which these findings have wider relevance remains unclear. This thesis focuses on determining the thermal conductivity of GNPs/f-BN polymer composites at different filler sizes (GNPs-5 μm and BN-10 μm) and silane coupling agents (KH550 and KH560); to study the mechanical properties of hybrid GNPs/f-BN polymer composites at elevated temperatures. Prior to commencing this study, the thermal conductivity of the polymer composite was done using KD2 Pro Thermal Properties Analyzer before undergoing lap shear test for mechanical analysis by using Instron 8872 Universal Testing Machine (UTM). RT, 150ºC, 200ºC and 250ºC was selected as heating temperatures for mechanical analysis. Field Emission Scanning Electron Microscope (FESEM) was used to examine fillers dispersion because it often affects the thermal and mechanical properties of the polymer composite. The result of thermal conductivity for modified BN fillers shows significant improvement for both single and hybrid polymer composite with the value enhancement up to 37% and 86.4%, respectively. Hybridising GNPs with KH560 modified BN (f_BN_KH560) shows the highest thermal conductivity obtained at 0.37 ± 0.060 W/mK, especially at the ratio of 75-GNPs and 25-BN (75/25). The mechanical strength (shear strength and Young’s modulus) of f-BN has further shown a good improvement than pristine BN, especially for f_BN_KH560 composite, whose shear strength is 0.80 ± 0.02 MPa, while hybrid GNPs/f_ BN_KH560 is 1.20 ± 0.10 MPa. The silane treated on BN was observed to successfully forms a chemical bond between the inorganic particles and the resin, allowing for more efficient stress transfer from the matrix to the fillers. GNPs/f-BN_KH560 that has good filler dispersion reported the highest shear strength and reveals a cohesive failure. However, when the hybrid composites were exposed to a high temperature, the mechanical strength of the modified hybrid composite starts to degrade due to softening effect and shows partial cohesive adhesion. The knowledge gained was believed would be beneficial to extend the use of functionalised BN with GNPs/BN as TIM.
| Item Type: | Thesis (Masters) |
|---|---|
| Uncontrolled Keywords: | Materials, Thermal properties, Composite materials |
| Subjects: | T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Library > Tesis > FKM |
| Depositing User: | F Haslinda Harun |
| Date Deposited: | 29 Sep 2022 12:21 |
| Last Modified: | 29 Sep 2022 12:21 |
| URI: | http://eprints.utem.edu.my/id/eprint/25989 |
| Statistic Details: | View Download Statistic |
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