Mohd Noh, Mohd Syahrin Amri (2025) Silicon die chipping improvement through full sandwich double-sided wafer mounting technique. Doctoral thesis, Universiti Teknikal Malaysia Melaka.
![[img]](http://eprints.utem.edu.my/style/images/fileicons/text.png) |
Text (24 Pages)
Silicon die chipping improvement through full sandwich double-sided wafer mounting technique (24 pages).pdf - Submitted Version Download (1MB) |
|
Text (Full Text)
Silicon die chipping improvement through full sandwich double-sided wafer mounting technique.pdf - Submitted Version Download (9MB) |
Abstract
This study investigates the development and evaluation of new wafer mounting techniques designed to enhance wafer holding capability, with the primary objective of minimizing chipping and improving the flexural strength of silicon dies by reducing vibration during the wafer dicing process. The conventional single-sided wafer mounting approach was found to be inadequate, particularly in stabilizing non-polished wafers with backgrinding marks, which resulted in insufficient tape adhesion, increased vibration, and compromised mechanical stability during dicing. Chipping was identified as the most critical defect, accounting for 15% of failures within the 23% defect rate related to wafer dicing processes. To address these limitations, double-sided semi-sandwich and full-sandwich wafer mounting configurations were developed and evaluated using UV Tape A, UV Tape B, and non-UV tape. A key focus of the study was the optimisation of UV curing parameters, particularly curing speed, to enable the automatic removal of surface UV mounting tape after dicing, ensuring a seamless transition to subsequent processing steps. Experimental findings showed that UV tape with an adhesive strength of 30 mN/25 mm achieved complete detachment when cured at an optimized speed of 10 mm/s.To assess the impact of this optimization, a comprehensive comparative analysis was performed between the conventional single-sided wafer mounting technique and the proposed double-sided configurations, namely the semi sandwich and full sandwich wafer mounting techniques. Comparative analysis revealed that the full sandwich configuration significantly outperformed the conventional single-sided method, achieving an 84% reduction in topside chipping, a 40% enhancement in die flexural strength, and a 26% reduction in vibration amplitude during dicing. These results validate the double-sided full sandwich wafer mounting technique as a novel and practical solution for improving wafer dicing performance in semiconductor manufacturing applications.
| Item Type: | Thesis (Doctoral) |
|---|---|
| Uncontrolled Keywords: | Semiconductors -- manufacture, Semiconductor wafers -- processing, Silicon -- fabrication |
| Subjects: | Q Science > QC Physics T Technology > TK Electrical engineering. Electronics Nuclear engineering T Technology > TS Manufactures |
| Divisions: | Library > Tesis > FTKM |
| Depositing User: | Norhairol Khalid |
| Date Deposited: | 23 Feb 2026 06:12 |
| Last Modified: | 23 Feb 2026 06:12 |
| URI: | http://eprints.utem.edu.my/id/eprint/29566 |
| Statistic Details: | View Download Statistic |
Actions (login required)
 |
View Item |