Items where Author is "Chua, Kok Yau"

Thangaraj, Joseph Sahaya Anand and Mohd Abid, Mohd Asyadi 'Azam and Subramonian, Sivarao and Buang, Zolkepli and K.M.Rajan, Rajes and Mat Yusoff, Nurul Hazliza and Abdul Aziz, Mohd Zaidan and Chua, Kok Yau (2015) HRTEM analysis of magnetron sputtered Ni4Al thin films. Applied Mechanics and Materials, 761. pp. 504-509. ISSN 1660-9336

Thangaraj, Joseph Sahaya Anand and Mohd Abid, Mohd Asyadi 'Azam and Subramonian, Sivarao and Buang, Zolkepli and K.M.Rajan, Rajes and Mat Yusoff, Nurul Hazliza and Abdul Aziz, Mohd Zaidan and Chua, Kok Yau (2015) Hrtem Studies Of Magnetron Sputtered Ni4al Thin Films. Applied Mechanics and Materials, 761 (-). pp. 504-509. ISSN -

Chua, Kok Yau (2015) The micro-structural characterization of thermosonic cu-al intermetallic compounds and modelling of its interface stress. Doctoral thesis, Universiti Teknikal Malaysia Melaka.

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Jalar, Azman (2014) Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Advanced Materials Research, 925. pp. 154-158. ISSN 1662-8985

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Yeow, See Leong and Lim, Weng Keat and Hng, May Ting (2013) Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads. Current Applied Physics, 13 (8). pp. 1674-1683. ISSN 1567-1739

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Jalar, Azman (2013) Micro-structural studies of thermosonic Cu-Al bonding interface. In: Joint International Conference on Nanoscience, Engineering and Management, 19-21 August 2013, Penang. (In Press)

Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2013) XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip. Advanced Materials Research, 620. pp. 166-172. ISSN 10226680

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Abd Rashid, Mohd Warikh and Hng, May Ting and Lee, Cher Chia (2012) Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15-16 October 2012, Hotel Equatorial, Melaka.

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Lim, Boon Huat (2012) Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip. Materials Chemistry and Physics, 136 (2-3). pp. 638-647. ISSN 0254-0584

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) X-ray Diffraction Study of Intermetallic Cu-Al Interconnection in Electronic Components. In: International Conference of Young Researchers on Advanced Materials, July 1 - 6, 2012, MATRIX Building< National University of Singapore (NUS), Singapore. (Unpublished)

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. In: International Conference on X-Rays & Related Techniques in Research & Industry , 3-5 July 2012, Vistana Hotel, Penang.

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang.

Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2003) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. Advanced Materials Research, 620. pp. 166-172. ISSN 1022-6680