Items where Author is "Chua, Kok Yau"

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Number of items: 12.

Article

T., Joseph Sahaya Anand and Mohd Abid, Mohd Asyadi Azam and Sivarao, Subramonian and Buang, Zolkepli and Rajes, KM Rajan and Hazliza, Nurul and Mohd Zaidan, Abd Aziz and Chua, Kok Yau (2015) HRTEM analysis of magnetron sputtered Ni4Al thin films. Applied Mechanics and Materials, 761. pp. 504-509. ISSN 1660-9336

Anand, T Joseph Sahaya and Mohd Abid, Mohd Asyadi 'Azam and Subramonian, Sivarao and Buang, Zolkepli and K M Rajan, Rajes and Mat Yusoff, Nurul Hazliza and Abdul Aziz, Mohd Zaidan and Chua, Kok Yau (2015) Hrtem Studies Of Magnetron Sputtered Ni4al Thin Films. Applied Mechanics and Materials, 761 (-). pp. 504-509. ISSN -

T., Joseph Sahaya Anand and Chua, Kok Yau and A., Jalar (2014) Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Advanced Materials Research, 925. pp. 154-158. ISSN 1662-8985

T., Joseph Sahaya Anand and Chua, Kok Yau (2013) Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads. Current Applied Physics, 13 (8). pp. 1674-1683. ISSN 1567-1739

Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2013) XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip. Advanced Materials Research, 620. pp. 166-172. ISSN 10226680

T., Joseph Sahaya Anand and Chua, Kok Yau (2012) Oxidation study on as-bonded intermetallic of Copper wire-Aluminum bond pad metallization for electronic microchip. Materials Chemistry and Physics, 136 (2-3). pp. 638-647. ISSN 0254-0584

Conference or Workshop Item

T., Joseph Sahaya Anand and Chua, Kok Yau (2013) Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. In: Joint International Conference on Nanoscience, Engineering and Management, 19-21 August 2013, Penang. (In Press)

Chua, Kok Yau and A.R.M., Warikh and T., Joseph Sahaya Anand (2012) Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15-16 October 2012, Hotel Equatorial, Melaka.

T., Joseph Sahaya Anand and Chua, Kok Yau (2012) X-ray Diffraction Study of Intermetallic Cu-Al Interconnection in Electronic Components. In: International Conference of Young Researchers on Advanced Materials, July 1 - 6, 2012, MATRIX Building< National University of Singapore (NUS), Singapore. (Unpublished)

Chua, Kok Yau and T., Joseph Sahaya Anand (2012) XRD ANALYSIS OF Cu-Al INTERCONNECT INTERMETALLIC COMPOUND IN AN ANNEALED MICRO-CHIP. In: International Conference on X-Rays & Related Techniques in Research & Industry , 3-5 July 2012, Vistana Hotel, Penang.

Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and T., Joseph Sahaya Anand (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang. (Submitted)

Thesis

Chua, Kok Yau (2015) The Micro-Structural Characterization Of Thermosonic Cu-Al Intermetallic Compounds And Modelling Of Its Interface Stress. Doctoral thesis, Universiti Teknikal Malaysia Melaka.

This list was generated on Sat Oct 16 18:45:47 2021 +08.