Tan, Cheerrein Cher Ring (2021) Smart control sampling system for metrology tool in semiconductor production line. Masters thesis, Universiti Teknikal Malaysia Melaka.
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Abstract
This research is to implement a Smart Control Sampling (SCS) system for metrology tool in the Semiconductor industry factory for better traceability and dynamic control on quality sampling for wire bond proces. Wire Bond process is one of the most critical process in the overall assembly line whereby it is the bonding of gold wire to a bond pad by a mechanical joining process. Investigation was conducted on the inspection platform by the metrology Automated Optical Inspection tool, the current production practice is dependent on human and causing the sampling compliancy issue. There is also no system setup for the metrology tools in the process flow for the product to be sampled accordingly hence no traceability for the sampled lot data. The SCS system designed with automated sampling schedule triggering to eliminate human dependant sampling frequency that are high potentially causes human error and risk on process quality. The main objectives of this project includes the identification of data needed to collect and the current sampling plan, to develop a SCS to automate the sampling schedule triggering, achieve 100% inspection sampling compliancy in the production, and to investigate the impact to yield loss performance and overall metrology tool processing time. This sampling system is completed developing in two phases where the first phase is the fundamental design of the sampling framework that able to auto-trigger the sampling frequency based on the sampling-rule while second phase of this system is even smarter to add in the risk-based-sampling features that are more dynamic in a way. SCS system is very efficient to improve the yield performance of 0.13% with ANOVA test of 95% confident level yet continuous improvement is needed to add more function, features and connect to more application to better monitor, collect and analyze the sampling data.
| Item Type: | Thesis (Masters) |
|---|---|
| Uncontrolled Keywords: | Engineering inspection, Quality control, Wire bonding (Electronic packaging), Production control |
| Subjects: | T Technology > T Technology (General) T Technology > TS Manufactures |
| Divisions: | Library > Tesis > FKP |
| Depositing User: | F Haslinda Harun |
| Date Deposited: | 24 Mar 2023 13:13 |
| Last Modified: | 24 Mar 2023 13:13 |
| URI: | http://eprints.utem.edu.my/id/eprint/26661 |
| Statistic Details: | View Download Statistic |
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